SK hynix, on Monday, announced that it began the mass production of SOCAMM2, a next-generation memory module developed to increase performance and power efficiency in artificial intelligence servers.

SK hynix said Monday it has begun mass production of its 192GB small outline compression attached memory module 2 (SOCAMM2), ...

The SK hynix logo and a computer motherboard appear in this illustration taken August 25, 2025. REUTERS/Dado ...

SK hynix said Monday it has begun mass production of SOCAMM2, a next-generation memory module designed to significantly boost ...

SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...

SK Hynix has begun mass production of 192GB SOCAMM2 memory modules designed specifically for NVIDIA's AI server platforms, ...

ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...

SK hynix continues development of next-generation DRAM and AI memory solutions, targeting improved efficiency and performance ...

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...

米Micronは1月9日（現地時間）、LPDDR5Xメモリをベースに、優れた電力効率と省スペース性を兼ね備えたメモリーモジュール、LPCAMM2(low-power compression attached memory module）の提供を開始した。ノートPCや小型フォームファクタのデスクトップPCに、優れた転送速度と ...

アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...